Amaoe iP 11 Series BGA Reballing Stencil
7.49 £
Amaoe iP 11 Series BGA Reballing Stencil
In stock
7.49 £
Brand:
Amaoe
- Tailored for iPhone 11 Series: Custom laser-etched BGA reballing stencil covering iPhone 11, 11 Pro, and 11 Pro Max logic boards.
- Heat-Resistant Japanese Steel: High-grade stainless steel construction prevents bulging, warping, and deformation during hot air reflow.
- Anti-Bridging Square Cutouts: Precision square rounded-corner apertures ensure smooth solder paste release and prevent short circuits.
Details
Amaoe iPhone 11 Series BGA Reballing Stencil
Perform precise logic board repairs with the Amaoe iP 11 Series BGA Reballing Stencil. Specially engineered for professional micro-soldering technicians, this high-precision stencil covers all essential IC reballing patterns and middle-layer board alignments for the iPhone 11, 11 Pro, and 11 Pro Max.
Key Features & Performance
- Dedicated iPhone 11 Matrix: Features accurate cutout positions for A13 Bionic CPU, Baseband, PMIC, Audio IC, NAND flash, and interposer middle board reballing.
- High-Grade Japanese Steel: Manufactured from premium heat-resistant stainless steel that maintains flat positioning under high benchtop temperatures.
- Precision Laser-Cut Openings: CNC laser-etched square cutouts with rounded internal corners ensure uniform solder paste release and prevent solder ball bridging.
- Microscope Alignment Markings: Etched guides provide clear visibility under microscope magnification for instant IC placement.
Applications
- iPhone 11 / 11 Pro / 11 Pro Max Board-Level Micro-Soldering
- Double-Decker Logic Board Reballing & Re-Joining
- Power Management IC, Baseband & A13 CPU Rework
Data
Weight:
40 g/pcs
