Amaoe Universal BGA Reballing Stencil 0.3mm-0.5mm Pitch
7.49 £
Amaoe Universal BGA Reballing Stencil 0.3mm-0.5mm Pitch
In stock
7.49 £
Brand:
Amaoe
- Universal 0.3mm–0.5mm Multi-Pitch: Covers multiple micro-BGA grid pitches (0.3mm, 0.35mm, 0.4mm, 0.45mm, 0.5mm) for versatile IC reballing.
- Heat-Resistant Japanese Steel: Precision laser-cut apertures manufactured from high-grade stainless steel to prevent warping under hot air exposure.
- Anti-Bulging Aperture Layout: Engineered with square rounded-corner cutouts to ensure uniform solder paste release and prevent solder bridging.
Details
Amaoe Universal BGA Reballing Stencil (0.3mm – 0.5mm Pitch)
Streamline your logic board IC reballing workflow with the Amaoe Universal BGA Reballing Stencil. Specially designed for smartphone repair specialists and micro-soldering engineers, this versatile stencil features multiple precision pitch grids ranging from 0.3mm to 0.5mm, making it an essential tool for reballing diverse integrated circuits (ICs), power management chips (PMICs), and audio codecs.
Key Features & Performance
- Multi-Pitch Versatility: Integrates 0.3mm, 0.35mm, 0.4mm, 0.45mm, and 0.5mm pitch array patterns onto a single durable sheet to handle various SMD and BGA chip footprints.
- High-Grade Japanese Steel: Constructed from premium heat-resistant stainless steel that resists deformation, warping, and bulging during high-temperature hot air reflow.
- Precision Laser-Cut Openings: CNC laser-etched square cutouts with rounded internal corners ensure clean solder paste release and prevent solder ball bridging.
- Microscope Alignment Markings: Crisp etched alignment grids allow fast, accurate IC positioning under microscope magnification.
Applications
- iPhone, Android & Tablet Logic Board BGA Reballing
- PMIC, Audio Codec, Wi-Fi IC & Baseband Chip Rework
- General PCB Repair & Micro-Component Soldering
Data
Weight:
40 g/pcs
