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  1. Soldering Flux
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  2. Soldering Flux

AiXun UP 200 10cc Crystal Clear Solder Flux Kit

AiXun UP 200 10cc Crystal Clear Solder Flux Kit
AiXun UP 200 10cc Crystal Clear Solder Flux Kit
AiXun UP 200 10cc Crystal Clear Solder Flux Kit
AiXun UP 200 10cc Crystal Clear Solder Flux Kit
AiXun UP 200 10cc Crystal Clear Solder Flux Kit
AiXun UP 200 10cc Crystal Clear Solder Flux Kit
AiXun UP 200 10cc Crystal Clear Solder Flux Kit
AiXun UP 200 10cc Crystal Clear Solder Flux Kit
AiXun UP 200 10cc Crystal Clear Solder Flux Kit
AiXun UP 200 10cc Crystal Clear Solder Flux Kit
Out of stock
9.99 £
Brand:
AiXun
Out of stock

10cc No-Clean Lead-Free Nano Solder Flux Syringe Kit

  • Advanced Nano Technology: Enhanced flux activity delivers superior wetting action and smooth solder flow.
  • Crystal Clear Residue: Leaves a non-conductive, transparent finish that eliminates electrical leakage risks.
  • Precision Syringe Kit: Includes syringe plunger and dispensing tip for controlled micro-dosing on dense circuitry.
Details

Please Note: Pictures are for illustration purposes only. Includes syringe plunger and dispensing tip.

AiXun UP 200 10cc Lead-Free Nano Soldering Flux Kit

Achieve high-precision solder connections with the AiXun UP 200 10cc Lead-Free Nano Soldering Flux Kit. Formulated specifically for micro-soldering technicians and mobile device repair specialists, this advanced nano-tech gel flux ensures exceptional wetting and thermal transfer across delicate printed circuit board (PCB) components.

The crystal-clear, lead-free formula minimizes smoke and residue during hot-air rework and hand soldering. Its non-conductive, low-resistance composition renders it ideal for fine-pitch BGA reballing, SMD component placement, and smartphone logic board trace repair without risk of electrical bridging.

Key Performance Features:

  • Nano-Particle Formulation: Maximizes wetting efficiency and heat dispersal to produce clean, bright solder joints.
  • Crystal Clear Finish: Dries transparent and non-corrosive, allowing easy visual inspection of reflowed ICs and traces.
  • High Oxidation Resistance: Prevents solder bridging and oxidation during continuous hot-air reflow operations.
  • Precision Micro-Dosing: Syringe barrel design allows accurate application directly onto micro BGA pads.
  • Universal Application: Suitable for logic board repairs on iPhones, Android devices, laptops, and micro-electronics.
Data
Weight:
60 g/pcs
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