2UUL Red Skull 199°C High Temperature Lead-Free Solder Paste 50g
9.99 £
2UUL Red Skull 199°C High Temperature Lead-Free Solder Paste 50g
In stock
9.99 £
Brand:
2UUL
MPN:
Red Skull (2UULRS199)
- 199°C High-Temperature Melting Point: Specially formulated lead-free alloy delivers robust structural solder joints for high-stress logic board components.
- 50g High-Capacity Jar: Generous supply designed for professional repair benches, high-volume reballing, and daily micro-soldering tasks.
- Superior Wettability & Conductivity: Formulated to reduce voiding, prevent solder bridging, and resist thermal oxidation during BGA reballing.
Details
Professional 199°C High-Temperature Lead-Free Solder Paste
The 2UUL Red Skull 199°C Solder Paste (50g) is a premium lead-free soldering alloy engineered for mobile repair technicians, micro-soldering specialists, and electronics rework engineers. Developed specifically for demanding logic board repairs, the 199°C melting point provides exceptional mechanical strength and heat endurance for critical surface-mount integrated circuits.
Key Specifications & Benefits
- High Thermal Endurance: Ideal for high-stress BGA components, power management ICs (PMICs), CPUs, and NAND flash memory requiring strong thermal fatigue resistance.
- Clean Lead-Free Formulation: Environmentally compliant alloy matrix that delivers bright, uniform solder joints with minimal flux residue post-reflow.
- Oxidation Resistance: Advanced flux vehicle prevents premature drying in open jar containers and maintains stable viscosity during extended stencil printing.
- Prevents Solder Bridging: Fine particle distribution ensures accurate stencil release and prevents microscopic short circuits under tight-pitch ICs.
- Universal PCB Application: Suitable for Apple iPhone, iPad, MacBook, Samsung Galaxy, and all major mobile logic board repair workflows.
Technical Specifications
- Brand: 2UUL
- Model Series: Red Skull
- Melting Point: 199°C
- Alloy Composition: Lead-Free (Pb-Free)
- Net Weight: 50g
- Packaging: Sealed Jar Container
- Application: BGA Reballing, CPU / NAND Soldering, PCB Surface Rework
Storage & Handling Guidelines
For maximum shelf life and consistent viscosity, store between 5°C and 10°C. Allow the container to reach ambient room temperature naturally before opening to prevent atmospheric moisture condensation inside the paste.
Data
Weight:
60 g/pcs