2UUL DA11 Hand Finish PCB Underfill Edge Glue Remover Tips Set
9.49 £
2UUL DA11 Hand Finish PCB Underfill Edge Glue Remover Tips Set
In stock
9.49 £
Brand:
2UUL
MPN:
DA11 (2UULDA11)
Colour:
Silver / Metallic
- Hand-Finished Precision Tips: Ultra-thin flexible alloy steel blades engineered specifically for scraping tough black underfill resin and frame glue.
- Trace-Safe Flexible Edges: Micro-milled profiles glide beneath surface-mount BGA ICs without damaging logic board solder mask or traces.
- High Thermal Resistance: Heat-tolerant construction withstands direct exposure to hot air rework stations without losing blade temper.
Details
Professional Hand-Finished Micro-Soldering Glue Scraping Tips
The 2UUL DA11 Hand Finish PCB Underfill Edge Glue Remover Tips Set is an essential micro-soldering hand tool designed for mobile repair technicians, board-level service engineers, and micro-electronics specialists. Individually hand-finished from high-hardness alloy steel, these precision blade tips enable effortless removal of tough black resin, frame glue, and CPU/NAND underfill adhesive on smartphone logic boards.
Key Specifications & Benefits
- Hand-Polished Precision Edges: Features razor-sharp, ultra-thin blade contours tailored for clearing frame glue, slicing BGA underfill, and cleaning IC pads.
- Trace-Safe Micro-Milling: Flexible blade geometry allows smooth scraping under surface-mount chips without scratching internal copper traces or delicate solder mask coatings.
- Hot Air Rework Station Compatible: Engineered to withstand continuous high-temperature hot air exposure during underfill softening and component removal.
- Universal Handle Fitment: Standardized mounting shanks fit securely into standard precision scalpel handles and micro-soldering knife holders.
- Resilient Alloy Construction: Premium hardened steel maintains structural integrity and edge sharpess through repeated scraping cycles.
Technical Specifications
- Model: 2UUL DA11 (2UULDA11)
- Product Type: PCB Underfill & Edge Glue Remover Tips
- Material: Hand-Finished High-Hardness Alloy Steel
- Thermal Resistance: High-Temperature Hot Air Rework Safe
- Application: BGA IC Scraping, CPU/NAND Underfill Removal, Frame Glue Cleaning
Data
Weight:
100 g/pcs
