2UUL BH11 Silicone Mid Frame Reballing Platform
Universal Silicone Magnetic Base Platform for PCB Mid-Frame Reballing
- Strong Magnetic Clamping: Integrated high-strength magnets keep reballing stencils and PCBs securely aligned during reflow.
- Heat-Resistant Silicone Construction: Non-slip, thermal-insulating base withstands hot-air gun soldering temperatures.
- Universal Logic Board Fit: Designed for reballing double-stacked sandwich logic boards and mid-frame components across various smartphone models.
Please Note: Pictures are for illustration purposes only. Reballing stencils sold separately.
2UUL BH11 Universal Silicone Mid-Frame Reballing Magnetic Platform
Upgrade your micro-soldering precision with the 2UUL BH11 Universal Silicone Mid-Frame Reballing Magnetic Platform. Engineered specifically for mobile phone repair technicians, this platform simplifies the complex process of reballing and soldering double-layered (sandwich) motherboard mid-frames.
Featuring a heavy-duty heat-resistant silicone base integrated with strong positioning magnets, the BH11 securely clamps reballing stencils and PCBs in place. The flexible, non-slip silicone construction insulates the workbench from excessive heat while providing total stability during hot-air gun application.
Key Performance Features:
- Powerful Magnetic Positioning: Holds BGA stencils flush against the middle frame for accurate solder paste printing and even ball formation.
- High Thermal Tolerance: Premium silicone material resists high hot-air rework temperatures without warping or melting.
- Universal Application: Compatible with a wide range of smartphone logic boards, including double-stacked iPhone and Android platforms.
- Non-Slip Bench Stability: Grips the repair station firmly to prevent micro-movements during fine-pitch soldering operations.
- Compact Repair Fixture: Durable, lightweight design fits comfortably under microscopes and desktop rework stations.