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2UUL BH11 Silicone Mid Frame Reballing Platform

2UUL BH11 Silicone Mid Frame Reballing Platform
2UUL BH11 Silicone Mid Frame Reballing Platform
2UUL BH11 Silicone Mid Frame Reballing Platform
2UUL BH11 Silicone Mid Frame Reballing Platform
2UUL BH11 Silicone Mid Frame Reballing Platform
2UUL BH11 Silicone Mid Frame Reballing Platform
2UUL BH11 Silicone Mid Frame Reballing Platform
2UUL BH11 Silicone Mid Frame Reballing Platform
2UUL BH11 Silicone Mid Frame Reballing Platform
2UUL BH11 Silicone Mid Frame Reballing Platform
2UUL BH11 Silicone Mid Frame Reballing Platform
2UUL BH11 Silicone Mid Frame Reballing Platform
Out of stock
15.99 £
Brand:
2UUL
Out of stock

Universal Silicone Magnetic Base Platform for PCB Mid-Frame Reballing

  • Strong Magnetic Clamping: Integrated high-strength magnets keep reballing stencils and PCBs securely aligned during reflow.
  • Heat-Resistant Silicone Construction: Non-slip, thermal-insulating base withstands hot-air gun soldering temperatures.
  • Universal Logic Board Fit: Designed for reballing double-stacked sandwich logic boards and mid-frame components across various smartphone models.
Details

Please Note: Pictures are for illustration purposes only. Reballing stencils sold separately.

2UUL BH11 Universal Silicone Mid-Frame Reballing Magnetic Platform

Upgrade your micro-soldering precision with the 2UUL BH11 Universal Silicone Mid-Frame Reballing Magnetic Platform. Engineered specifically for mobile phone repair technicians, this platform simplifies the complex process of reballing and soldering double-layered (sandwich) motherboard mid-frames.

Featuring a heavy-duty heat-resistant silicone base integrated with strong positioning magnets, the BH11 securely clamps reballing stencils and PCBs in place. The flexible, non-slip silicone construction insulates the workbench from excessive heat while providing total stability during hot-air gun application.

Key Performance Features:

  • Powerful Magnetic Positioning: Holds BGA stencils flush against the middle frame for accurate solder paste printing and even ball formation.
  • High Thermal Tolerance: Premium silicone material resists high hot-air rework temperatures without warping or melting.
  • Universal Application: Compatible with a wide range of smartphone logic boards, including double-stacked iPhone and Android platforms.
  • Non-Slip Bench Stability: Grips the repair station firmly to prevent micro-movements during fine-pitch soldering operations.
  • Compact Repair Fixture: Durable, lightweight design fits comfortably under microscopes and desktop rework stations.
Data
Weight:
150 g/pcs
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