2UUL BH04 Micro Jig Reballing Fixture for eMMC BGA IC Repair

Professional High-Temperature Micro BGA IC Reballing Fixture

The 2UUL BH04 Micro Jig is a compact, high-precision micro-soldering clamp fixture engineered specifically for mobile repair technicians, data recovery specialists, and PCB refurbishment workshops. Designed to solve the difficulty of holding micro BGA integrated circuits, the BH04 provides total stability and thermal endurance when cleaning, reballing, and tinning eMMC, NAND flash, and power management ICs.

Key Specifications & Benefits

• High Thermal Endurance: Synthetic stone contact jaws withstand direct hot-air temperatures up to 500°C, shielding work surfaces and keeping delicate chips aligned.
• Precision Micro-Clamping: Smooth spring-driven slide mechanism locks onto tiny IC chips without applying crushing force to sensitive silicon dies.
• Micro-Soldering Precision: Prevents chip drift and movement when scraping tough underfill glue, applying solder paste, or holding reballing stencils under microscopes.
• Heavy Anti-Slip Footing: Solid metal base plate anchors the micro jig to the workbench during high-precision scraping and prying operations.
• Universal Small IC Compatibility: Ideal for servicing eMMC, UFS, NAND, CPU, and power IC components from Apple iPhone, iPad, Samsung Galaxy, and Android motherboards.

Technical Specifications

• Model: 2UUL BH04 (Micro Jig)
• Product Type: Micro BGA IC Reballing & Glue Removal Clamp
• Material: High-Density Synthetic Stone & Heavy Steel Base
• Heat Resistance: Up to 500°C
• Clamping Style: Spring-Loaded Micro Slider
• Application: eMMC, NAND Flash & BGA IC Reballing / Cleaning